TD-SCDMA 3G mobile-phone chipset features multifunction performance
A researcher compares a 50-cent RMB coin with newly invented TD-SCDMA 3G mobile-phone chipsets with 0.13 micron technology in Chongqing University of Post and Telecommunications in southwest China's Chongqing Municipality October 9, 2005. The invention of the small-size chipset that features low energy consumption and multifunction performance marks China has reached a new level in 3G communications chipset technology.
A researcher compares a 50-cent RMB coin with a newly invented TD-SCDMA 3G mobile-phone chipset with 0.13 micron technology in Chongqing University of Post and Telecommunications in southwest China's Chongqing Municipality October 9, 2005. The invention of the small-size chipset that features low energy consumption and multifunction performance marks China has reached a new level in 3G communications chipset technology.
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